G1A thru G1M
Vishay Semiconductors
formerly General Semiconductor
Document Number 88601
www.vishay.com
25-Feb-02
1
Glass Passivated Junction Rectifiers
Reverse Voltage
50 to 1000V
Forward Current 1.0A
Patented*
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
G1A
G1B
G1D
G1G
G1J
G1K
G1M
Unit
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
V
DC
50
70
200
400
600
800
1000
V
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 100°C
I
F(AV)
1.0
A
Peak forward surge current 8.3ms single half sine-wave
I
FSM
50
A
superimposed on rated load (JEDEC Method)
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at T
A
= 100°C
I
R(AV)
200
µ
A
Typical thermal resistance
(Note 1)
R
JL
55
°
C/W
Operating junction and storage temperature range
T
J
, T
STG
65 to +175
°C
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol G1A
G1B
G1D
G1G
G1J
G1K
G1M
Unit
Maximum instantaneous forward voltage at 1.0A
V
F
1.2
1.1
V
Maximum DC reverse current
T
A
= 25°C
2.0
at rated DC blocking voltage
T
A
= 150°C
I
R
100
µ
A
Typical reverse recovery time at
I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
t
rr
3.5
µ
s
Typical junction capacitance at 4.0V, 1MHz
C
J
15
pF
Note: (1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
Features
· High temperature metallurgically bonded
constructed rectifiers
· Cavity-free glass passivated junction in DO-204AP
package
· Hermetically sealed package
· 1.0 ampere operation at T
A
=100°C with no thermal runaway
· Typical I
R
less than 0.1
µ
A
· Capable of meeting environmental standards of
MIL-S-19500
· High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AP Solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 oz., 0.56 g
0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
DO-204AP
*
Brazed-lead assembly is covered by Patent No. 3,930,306
Dimensions in inches
and (millimeters)
G1A thru G1M
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88601
2
25-Feb-02
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
0
Fig. 1 Forward Current Derating Curve
A
verage Forward Rectified Current (A)
Ambient Temperature (
°
C)
25
0
50
75
100
125
150
175
0.2
0.4
0.6
0.8
1.0
60H
Z
Resistive or
Inductive Load
0.375" (9.5mm)
Lead Length
0
Fig. 2 Maximum Non-Repetitive
Peak Forward Surge Current
1
10
100
Number of Cycles at 60H
Z
10
20
30
40
50
Peak Forward Surge Current (A)
T
J
= T
J max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
Fig. 3 Typical Instantaneous
Forward Characteristics
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
0.01
0.1
1
10
Instantaneous Forward Current (A)
Pulse Width = 300
µ
s
1% Duty Cycle
T
J
= 25
°
C
0
Fig. 4 Typical Reverse Characteristics
0.01
0.1
1
10
Instantaneous Reverse Leakage Current (
µ
A)
60
80
100
20
40
Percent of Rated Peak Reverse Voltage (%)
T
J
= 25
°
C
T
J
= 75
°
C
T
J
= 125
°
C
Fig. 5 Typical Junction Capacitance
1
10
100
Reverse Voltage (V)
1
10
30
Junction Capacitance (pF)
T
J
= 25
°
C
f = 1.0MH
Z
Vsig = 50mVp-p
Capacitance
Load
Ipk/I
AV
= 5.0
10
20
T
J
= 150
°
C
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